Our processes are ISO 9001:2015 Bureau Veritas Certification and UL (UnderWriters Laboratories) certified. The printed circuit boards produced by Circuibras strictly follow the customer's technical specifications. When not specified, they are guided by IPC-A-600K (Acceptability of Printed Boards). All boards delivered to customers are electrically tested.
Technical Specifications: Questions about a technical term? Check the CIRCUIBRAS Technical Terms Dictionary
| Rigid PCB | ||||||||||
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| YEAR | 2024 | 2025 | 2026 | 2027 | ||||||
| TECHNICAL SPECIFICATIONS FOR THE | STANDARD | ADVANCED | STANDARD | ADVANCED | STANDARD | ADVANCED | STANDARD | ADVANCED | ||
| PRODUCTION AND CAPACITY | 5,500 square meters per month | 6,050 m²/month | 6,050 m²/month | 8,250 m²/month | ||||||
| MAX LAYERS | 16 layers | > 16 layers | 20 layers | > 20 layers | 22 layers | > 22 layers | 24 layers | Upon request | ||
| HDI ( ) (LAMINATED- -DESIGN) | 2+N+2 | Upon request | 3+N+3 | Upon request | 3+N+3 | Upon request | 3+N+3 | Upon request | ||
| RAW MATERIAL | FR4 – Lead-Free and -Compatible | Other materials: (available upon request) | FR4 – Lead-Free and -Compatible | Other materials: (available upon request) | FR4 – Lead-Free and -Compatible | Other materials: (available upon request) | FR4 – Lead-Free and -Compatible | Other materials: (available upon request) | ||
| FR4 – Halogen- -Free | FR4 – Halogen- -Free | FR4 – Halogen- -Free | FR4 – Halogen- -Free | |||||||
| TG | 135°C (CTI ≥ 600V) / 150°C / 180°C | |||||||||
| UL- -CERTIFICATION | 94V - 0 [ZPM V2 & V8] | |||||||||
| CAPPED VIA | According to IPC-4761 Type VII | |||||||||
| BACK DRILLING | According to IPC-2221 | |||||||||
| PRODUCT TYPES |
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| MINIMUM SOLDER MASK THICKNESS | Peelable (Solder Out) | |||||||||
| 6µm layer or according to IPC SM 840 | ||||||||||
| Available colors: Green, Blue, Black, Red, White, and other colors upon request | ||||||||||
| INK LEGEND COMPONENTS | Minimum trace width: 100µm (0.004") | |||||||||
| Minimum character height: 700µm (0.028") | ||||||||||
| Available colors: White, Black, Yellow, Red, and other colors upon request | ||||||||||
, AND FINISHING | HASL Sn/Pb | HASL Sn/Pb | - | - | ||||||
| - | HASL Lead Free | HASL Lead Free | HASL Lead Free | |||||||
| ENIG - Electroless- -Nickel Immersion Gold | ENIG - Electroless- -Nickel Immersion Gold | ENIG - Electroless- -Nickel Immersion Gold | ENIG - Electroless- -Nickel Immersion Gold | |||||||
| OSP - Organic Solvent- -Solderability Preservative | OSP - Organic Solvent- -Solderability Preservative | OSP - Organic Solvent- -Solderability Preservative | OSP - Organic Solvent- -Solderability Preservative | |||||||
| COMPLEMENTS | Peelable (Solder Out) | |||||||||
| Carbon paste contacts | ||||||||||
| Hard Gold: According to IPC 6012 or customer spec | ||||||||||
| ELECTRICAL AND TEST | According to IPC 9252 Class 2 (100% of boards tested) - Voltage: 250 V, Continuity ≤50 Ω and Insulation ≥ 2 MΩ | |||||||||
| MINIMUM PCB THICKNESS | 0.60mm (0.024') | < 0.60mm (0.024') | 0.40mm (0.016') | < 0.40mm (0.016') | 0.40mm (0.016') | < 0.40mm (0.016') | 0.40mm (0.016') | < 0.40mm (0.016') | ||
| MAXIMUM PCB THICKNESS | 3.20mm (0.125') | > 3.20 mm (0.125 in) | 5.00mm (0.197') | > 5.00 mm (0.197 in) | 5.00mm (0.197') | > 5.00 mm (0.197 in) | 5.00mm (0.197') | > 5.00 mm (0.197 in) | ||
| MINIMUM BGA | 0.35mm (0.014') | 0.30 mm ( ) | 0.30mm (0.012') | Upon request | 0.30mm (0.012') | Upon request | 0.30mm (0.012') | Upon request | ||
| TECHNICAL SPECIFICATIONS FOR THE | COPPER- -LAYER | TRACK/GAP | TRACK/GAP | TRACK/GAP | TRACK/GAP | TRACK/GAP | TRACK/GAP | TRACK/GAP | TRACK/GAP | |
| MIN EXTERNAL LAYERS TRACK/GAP | 1/2 oz s (17.5 μm) | 100 μm s (0.004') | 75 μm s (0.003') | 75 μm s (0.003') | 50 μm s (0.002') | 75 μm s (0.003') | 50 μm s (0.002') | 75 μm s (0.003') | 50 μm s (0.002') | |
| 1 oz s (35 μm) | 125 μm s (0.005') | 100 μm s (0.004') | 100 μm s (0.004') | 75 μm s (0.003') | 100 μm s (0.004') | 75 μm s (0.003') | 100 μm s (0.004') | 75 μm s (0.003') | ||
| 2 oz s (70 μm) | 175 μm s (0.007') | 150 μm s (0.006') | 150 μm s (0.006') | 125 μm s (0.005') | 150 μm s (0.006') | 125 μm s (0.005') | 150 μm s (0.006') | 125 μm s (0.005') | ||
| 3 oz s (105 μm) | 225 μm s (0.009') | Upon request | 225 μm s (0.009') | Upon request | 225 μm s (0.009') | Upon request | 225 μm s (0.009') | Upon request | ||
| MIN INNER LAYERS TRACK/GAP | 1/2 oz s (17.5 μm) | 75 μm s (0.003') | 50 μm s (0.002') | 50 μm s (0.002') | Upon request | 50 μm s (0.002') | Upon request | 50 μm s (0.002') | Upon request | |
| 1 oz s (35 μm) | 100 μm s (0.004') | 75 μm s (0.003') | 75 μm s (0.003') | Upon request | 75 μm s (0.003') | Upon request | 75 μm s (0.003') | Upon request | ||
| 2 oz s (70 μm) | 150 μm s (0.006') | 125 μm s (0.005') | 125 μm s (0.005') | Upon request | 125 μm s (0.005') | Upon request | 125 μm s (0.005') | Upon request | ||
| 3 oz s (105 μm) | 188 μm s (0.0075') | 163 μm s (0.0065') | 163 μm s (0.0065') | Upon request | 163 μm s (0.0065') | Upon request | 163 μm s (0.0065') | Upon request | ||
| PTH Copper- -Thickness | 20 μm (0.0008") – IPC Class 2 ≥ 25 μm (0.0010") – IPC Class 3 | |||||||||
| Minimum- -Annular Ring | 100 μm (0.004") , teardrop-shaped | 75 μm (0.003") , teardrop-shaped | 100 μm (0.004") , teardrop-shaped | 75 μm (0.003") , teardrop-shaped | 100 μm (0.004") , teardrop-shaped | 75 μm (0.003") , teardrop-shaped | 75 μm (0.003") , teardrop-shaped | 50 μm (0.002") , teardrop-shaped | ||
| Minimum Hole Diameter | 150μm (0.006") | < 150μm (0.006") | 150μm (0.006") | 100μm (0.004") | 150μm (0.006") | 100μm (0.004") | 75 μm (0.003 in) | 50 μm (0.004") | ||
| Drilling Tolerance | +/- 100μm (0.004") | +/- 75μm (0.003") | +/- 100μm (0.004") | +/- 50μm (0.002") | +/- 100μm (0.004") | +/- 50μm (0.002") | +/- 75μm (0.003") | +/- 50μm (0.002") | ||
's Tolerance | +/- 200 μm to 130 μm (0.008" to 0.005") | < +/- 130μm (0.005") | +/- 200 μm to 130 μm (0.008" to 0.005") | ± 100 μm ( ; 0.004") | +/- 200 μm to 130 μm (0.008" to 0.005") | ± 100 μm ( ; 0.004") | +/- 130 μm to 100 μm (0.005" to 0.004") | ± 75 μm ( ) (0.003") | ||
| Controlled- -impedance | +/- 10% | Upon request | +/- 10% | Upon request | +/- 10% | Upon request | +/- 10% | Upon request | ||
| Minimum thickness of the dielectric- | 100μm (0.004") | Upon request | 76μm (0.003") | Upon request | 76μm (0.003") | Upon request | 6oz (210μm) | Upon request | ||
| External copper- -thickness | 1/3 oz – 3 oz s (12 μm – 105 μm) | 4oz (140μm) | 1/3 oz – 3 oz s (12 μm – 105 μm) | 5oz (175μm) | 1/3 oz – 3 oz s (12 μm – 105 μm) | 6oz (210μm) | 1/3 oz – 3 oz s (12 μm – 105 μm) | Upon request | ||
| Internal copper- -thickness | 1/2 oz – 1 oz s (17.5 μm – 35 μm) | >2oz (70μm) | 1/2 oz – 3 oz s (17.5 μm – 35 μm) | >3oz (105μm) | 1/2 oz – 3 oz s (17.5 μm – 35 μm) | >3oz (105μm) | 1/2 oz – 3 oz s (17.5 μm – 35 μm) | >3oz (105μm) | ||