Our processes are ISO 9001:2015 Bureau Veritas Certification and UL (UnderWriters Laboratories) certified. The printed circuit boards produced by Circuibras strictly follow the customer's technical specifications. When not specified, they are guided by IPC-A-600K (Acceptability of Printed Boards). All boards delivered to customers are electrically tested.
Technical Specifications: Questions about a technical term? Check the CIRCUIBRAS Technical Terms Dictionary
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| Rigid PCB | |||
|---|---|---|---|
| TECHNICAL SPECIFICATIONS | STANDARD | ADVANCED | |
| PRODUCTION CAPACITY | 6,600 m²/month | ||
| MAX LAYERS | 22 layers | > 22 layers | |
| HDI (Laminated Design) | 3+N+3 | Upon request | |
| RAW MATERIAL | FR4 – Lead-Free Compatible | Other materials available upon request | |
| FR4 – Halogen-Free | |||
| TG | 135°C (CTI ≥ 600 V) / 150°C / 180°C | ||
| UL CERTIFICATION | 94V - 0 [ZPM V2 & V8] | ||
| CAPPED VIA | In accordance with IPC-4761 Type VII | ||
| BACK DRILLING | According to IPC-2221 | ||
| PRODUCT TYPES |
| ||
| MINIMUM SOLDER MASK THICKNESS | |||
| 6 µm layer or in accordance with IPC SM 840 | |||
| Available colors: Green, Blue, Black, Red, White, and other colors upon request | |||
| INK LEGEND COMPONENTS | Minimum trace width: 100 µm (0.004") | ||
| Minimum character height: 700 µm (0.028") | |||
| Available colors: White, Black, Yellow, Red, and other colors upon request | |||
| SURFACE FINISHING | - | ||
| Lead-Free HASL | |||
| ENIG - Electroless Nickel Immersion Gold | |||
| OSP - Organic Solderability Preservative | |||
| ACCESSORIES | Peelable (Solder Out) | ||
| Carbon paste contacts | |||
| Hard Gold: In accordance with IPC 6012 or customer specifications | |||
| ELECTRICAL TEST | According to IPC 9252 Class 2 (100% of boards tested) - Voltage: 250 V, Continuity ≤50 Ω and Insulation ≥ 2 MΩ | ||
| MINIMUM PCB THICKNESS | 0.40 mm (0.016') | < 0.40mm (0.016') | |
| MAXIMUM PCB THICKNESS | 5.00 mm (0.197') | > 5.00 mm (0.197') | |
| MINIMUM BGA | 0.30 mm (0.012') | Upon request | |
| TECHNICAL SPECIFICATIONS | COPPER LAYER | TRACK/GAP | TRACK/GAP |
| MIN EXTERNAL LAYERS TRACK/GAP | 1/2 oz (17.5 μm) | 75 μm (0.003') | 50 μm (0.002') |
| 1 oz (35 μm) | 100 μm (0.004') | 75 μm (0.003') | |
| 2 oz (70 μm) | 150 μm (0.006') | 125 μm (0.005') | |
| 3 oz (105 μm) | 225 μm (0.009') | Upon request | |
| MIN INNER LAYERS TRACK/GAP | 1/2 oz (17.5 μm) | 50 μm (0.002') | Upon request |
| 1 oz (35 μm) | 75 μm (0.003') | Upon request | |
| 2 oz (70 μm) | 125 μm (0.005') | Upon request | |
| 3 oz (105 μm) | 163 μm (0.0065') | Upon request | |
| PTH Copper Thickness | 20 μm (0.0008") – IPC Class 2 ≥ 25 μm (0.0010") – IPC Class 3 | ||
| Minimum Annular Ring | 100 μm (0.004") with teardrop | 75 μm (0.003") with teardrop | |
| Minimum Hole Diameter | 150 μm (0.006") | 100 μm (0.004") | |
| Drilling Tolerance | +/- 100 μm to 130 μm | +/- 5 μm (0.002") | |
| Dimensional Tolerance | +/- 200 μm to 130 μm (0.008" to 0.005") | +/- 100 μm (0.004") | |
| Controlled impedance | +/- 10% | Upon request | |
| Minimum dielectric thickness | 76 μm (0.003") | Upon request | |
| External copper thickness | 1/3 oz – 3 oz (12 μm – 105 μm) | 6 oz (210 μm) | |
| Internal copper thickness | 1/2 oz – 3 oz (17.5 μm – 35 μm) | >3 oz (105 μm) | |