Nossos processos são certificados pelas normas ISO 9001:2015 Bureau Veritas Certification e UL (UnderWriters Laboratories). As placas de circuitos impressos produzidas pela Circuibras seguem rigorosamente as especificações técnicas do cliente. Quando não especificado, orienta-se pela IPC-A-600K (Acceptability of Printed Boards). Todas as placas entregues aos clientes são testadas eletricamente.
Características Técnicas: Dúvidas com relação a algum termo técnico? Consulte o Dicionário de termos técnicos CIRCUIBRAS
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| Rigid PCB | |||
|---|---|---|---|
| TECHNICAL SPECIFICATIONS | STANDARD | ADVANCED | |
| PRODUCTION CAPACITY | 6,600m²/month | ||
| MAX LAYERS | 22 layers | > 22 layers | |
| HDI (LAMINATED DESIGN) | 3+N+3 | Upon request | |
| RAW MATERIAL | FR4 – Lead Free Compatible | Other materials upon request | |
| FR4 – Halogen Free | |||
| TG | 135°C (CTI ≥ 600V) / 150°C / 180°C | ||
| UL CERTIFICATION | 94V - 0 [ZPM V2 & V8] | ||
| CAPPED VIA | According to IPC-4761 Type VII | ||
| BACK DRILLING | According to IPC-2221 | ||
| PRODUCT TYPES |
| ||
| MINIMUM SOLDER MASK THICKNESS | |||
| 6µm layer or according to IPC SM 840 | |||
| Available colors: Green, Blue, Black, Red, White, other colors upon request | |||
| INK LEGEND COMPONENTS | Minimum trace width: 100µm (0.004") | ||
| Minimum character height: 700µm (0.028") | |||
| Available colors: White, Black, Yellow, Red, other colors upon request | |||
| SURFACE FINISHING | - | ||
| HASL Lead Free | |||
| ENIG - Electroless Nickel Immersion Gold | |||
| OSP - Organic Solderability Preservative | |||
| COMPLEMENTS | Peelable (Solder Out) | ||
| Carbon paste contacts | |||
| Hard Gold: According to IPC 6012 or customer spec | |||
| ELECTRICAL TEST | According to IPC 9252 Class 2 (100% of boards tested) - Voltage: 250V, Continuity ≤50 Ω and Isolation ≥ 2MΩ | ||
| MINIMUM PCB THICKNESS | 0.40mm (0.016') | < 0.40mm (0.016') | |
| MAXIMUM PCB THICKNESS | 5.00mm (0.197') | > 5.00mm (0.197') | |
| MINIMUM BGA | 0.30mm (0,012') | Upon request | |
| TECHNICAL SPECIFICATIONS | COPPER LAYER | TRACK/GAP | TRACK/GAP |
| MIN EXTERNAL LAYERS TRACK/GAP | 1/2oz (17.5μm) | 75μm (0.003') | 50μm (0.002') |
| 1oz (35μm) | 100μm (0.004') | 75μm (0.003') | |
| 2oz (70μm) | 150μm (0.006') | 125μm (0.005') | |
| 3oz (105μm) | 225μm (0.009') | Upon request | |
| MIN INNER LAYERS TRACK/GAP | 1/2oz (17.5μm) | 50μm (0.002') | Upon request |
| 1oz (35μm) | 75μm (0.003') | Upon request | |
| 2oz (70μm) | 125μm (0.005') | Upon request | |
| 3oz (105μm) | 163μm (0.0065') | Upon request | |
| PTH Copper Thickness | 20μm (0.0008") – IPC Class 2 ≥ 25μm (0.0010") – IPC Class 3 | ||
| Minimum Annular Ring | 100μm (0.004") with teardrop | 75μm (0.003") with teardrop | |
| Minimum Hole Diameter | 150μm (0.006") | 100μm (0.004") | |
| Drilling Tolerance | +/- 100μm to 130μm | +/- 5μm (0.002") | |
| Dimensional Tolerance | +/- 200μm to 130μm (0.008" to 0.005") | +/- 100μm (0.004") | |
| Controlled impedance | +/- 10% | Upon request | |
| Minimum dielectric thickness | 76μm (0.003") | Upon request | |
| External copper thickness | 1/3oz – 3oz (12μm – 105μm) | 6oz (210μm) | |
| Internal copper thickness | 1/2oz – 3oz (17.5μm – 35μm) | >3oz (105μm) | |