Circuibras is pleased to announce that we are the first national manufacturer to implement Capped Vias (Via Filling) technology! This breakthrough is a significant step in our journey to offer high quality and efficient solutions to our customers.
What is the Capped Vias Process? The Capped Vias process is essential for manufacturing High-Density Interconnections (HDI) printed circuit boards (PCBs). This technique involves applying a special resin to fill the holes in the board, preparing it for mounting SMD (Surface-Mount Device) components. This results in a more compact and efficient design, increasing the integrity and reliability of the boards.
Benefits of Capped Vias:
- High Density: Allows the creation of more compact designs with a higher density of interconnections.
- Efficiency: Meets the requirements of the most advanced industries, including aerospace, consumer electronics, automotive and telecommunications.
With the installation of this new machine, we reaffirm our commitment to supplying high quality products and cutting-edge technologies. Circuibras continues to invest in solutions that benefit our customers and drive the electronics industry forward.
Check out the difference: See the images of our new machine in action and compare the difference between a normal hole and one filled by the Capped Vias process.
Contact us for more information on how the Capped Vias process can benefit your next PCB project!
Commercial contact: circuibras.vendas@circuibras.com.br
