Nossos processos são certificados pelas normas ISO 9001:2015 Bureau Veritas Certification e UL (UnderWriters Laboratories). As placas de circuitos impressos produzidas pela Circuibras seguem rigorosamente as especificações técnicas do cliente. Quando não especificado, orienta-se pela IPC-A-600K (Acceptability of Printed Boards). Todas as placas entregues aos clientes são testadas eletricamente.
Características Técnicas: Dúvidas com relação a algum termo técnico? Consulte o Dicionário de termos técnico CIRCUIBRAS
| Rigid PCB | ||||||||
|---|---|---|---|---|---|---|---|---|
| TECHNICAL SPECIFICATIONS | 2024 | 2025 | 2026 | |||||
| STANDARD | ADVANCED | STANDARD | ADVANCED | STANDARD | ADVANCED | |||
| MAX LAYERS | 16 layers | > 16 layers | 20 layers | > 20 layers | 22 layers | > 22 layers | ||
| HDI (LAMINATED DESIGN) | 2+N+2 | Upon request | 3+N+3 | Upon request | 3+N+3 | Upon request | ||
| RAW MATERIAL | FR4 – Lead Free Compatible FR4 – Halogen Free | Other materials upon request | FR4 – Lead Free Compatible FR4 – Halogen Free | Other materials upon request | FR4 – Lead Free Compatible FR4 – Halogen Free | Other materials upon request | ||
| TG | 135°C (CTI ≥ 600V) / 150°C / 180°C | |||||||
| UL CERTIFICATION | 94V-0 [ZPMV2&V8] | |||||||
| CAPPED VIA | According to IPC-4761 Type VII | |||||||
| BACK DRILLING | According to IPC-2221 | |||||||
| PRODUCT TYPES | -HDI -Impedance control -BGA & Fine Pitch Board -HF (High Frequency) -RF (Radio Frequency) | -HDI -Impedance control -BGA & Fine Pitch Board -HF (High Frequency) -RF (Radio Frequency) -Semiflex | -HDI -Impedance control -BGA & Fine Pitch Board -HF (High Frequency) -RF (Radio Frequency) -Semiflex -Rigid-flex | |||||
| MINIMUM SOLDER MASK THICKNESS | ||||||||
| 6µm layer or according to IPC SM 840 | ||||||||
| Available colors: Green, Blue, Black, Red, White, other colors upon request | ||||||||
| INK LEGEND COMPONENTS | ||||||||
| Minimum trace width: 100µm (0.004") | ||||||||
| Minimum character height: 700µm (0.028") | ||||||||
| Available colors: White, Black, Yellow, Red, other colors upon request | ||||||||
| SURFACE FINISHING | HASL Sn/Pb | HASL Sn/Pb | - | |||||
| - | HASL Lead Free | HASL Lead Free | ||||||
| ENIG - Electroless Nickel Immersion Gold | ENIG - Electroless Nickel Immersion Gold | ENIG - Electroless Nickel Immersion Gold | ||||||
| OSP - Organic Solderability Preservative | OSP - Organic Solderability Preservative | OSP - Organic Solderability Preservative | ||||||
| COMPLEMENTS | Peelable (Solder Out) | |||||||
| Carbon paste contacts | ||||||||
| Hard Gold: According to IPC 6012 or customer spec | ||||||||
| ELECTRICAL TEST | According to IPC 9252 Class 2 (100% of boards tested) - Voltage: 250V, Continuity ≤50 Ω and Isolation ≥ 2MΩ | |||||||
| MINIMUM PCB THICKNESS | 0.60mm (0.024') | < 0.60mm (0.024') | 0.40mm (0.016') | < 0.40mm (0.016') | 0.40mm (0.016') | < 0.40mm (0.016') | ||
| MAXIMUM PCB THICKNESS | 3.20mm (0.125') | > 3.20mm (0.125') | 5.00mm (0.197') | > 5.00mm (0.197') | 5.00mm (0.197') | > 5.00mm (0.197') | ||
| MINIMUM BGA | 0.35mm (0,014') | 0.30mm (0,012') | 0.30mm (0,012') | Upon request | 0.30mm (0,012') | Upon request | ||
| 2024 | 2025 | 2026 | ||||||
| TECHNICAL SPECIFICATIONS | COPPER LAYER | STANDARD | ADVANCED | STANDARD | ADVANCED | STANDARD | ADVANCED | |
| MIN EXTERNAL LAYERS TRACK/GAP | 1/2oz (17.5μm) | 100μm (0.004') | 75μm (0.003') | 75μm (0.003') | 50μm (0.002') | 75μm (0.003') | 50μm (0.002') | |
| 1oz (35μm) | 125μm (0.005') | 100μm (0.004') | 100μm (0.004') | 75μm (0.003') | 100μm (0.004') | 75μm (0.003') | ||
| 2oz (70μm) | 175μm (0.007') | 150μm (0.006') | 150μm (0.006') | 125μm (0.005') | 150μm (0.006') | 125μm (0.005') | ||
| 3oz (105μm) | 225μm (0.009') | Upon request | 225μm (0.009') | Upon request | 225μm (0.009') | Upon request | ||
| MIN INNER LAYERS TRACK/GAP | 1/2oz (17.5μm) | 75μm (0.003') | 75μm (0.003') | 50μm (0.002') | 50μm (0.002') | 50μm (0.002') | 50μm (0.002') | |
| 1oz (35μm) | 100μm (0.004') | 100μm (0.004') | 75μm (0.003') | 75μm (0.003') | 75μm (0.003') | 75μm (0.003') | ||
| 2oz (70μm) | 150μm (0.006') | 150μm (0.006') | 125μm (0.005') | 125μm (0.005') | 125μm (0.005') | 125μm (0.005') | ||
| 3oz (105μm) | 188μm (0.0075') | 188μm (0.0075') | 163μm (0.0065') | 163μm (0.0065') | 163μm (0.0065') | 163μm (0.0065') | ||
| PTH Copper Thickness | 20μm (0.0008") – IPC Class 2 ≥ 25μm (0.0010") – IPC Class 3 | |||||||
| Minimum Annular Ring | 100μm (0.004") with teardrop | 75μm (0.003") with teardrop | 100μm (0.004") with teardrop | 75μm (0.003") with teardrop | 100μm (0.004") with teardrop | 75μm (0.003") with teardrop | ||
| Minimum Hole Diameter | 150μm (0.006") | < 150μm (0.006") | 150μm (0.006") | 100μm (0.004") | 150μm (0.006") | 100μm (0.004") | ||
| Drilling Tolerance | +/- 100μm (0.004") | +/- 75μm (0.003") | +/- 100μm (0.004") | +/- 50μm (0.002") | +/- 100μm (0.004") | +/- 50μm (0.002") | ||
| Dimensional Tolerance | +/- 200μm to 130μm (0.008" to 0.005") | < +/- 130μm (0.005") | +/- 200μm to 130μm (0.008" to 0.005") | +/- 100μm (0.004") | +/- 200μm to 130μm (0.008" to 0.005") | +/- 100μm (0.004") | ||
| 2024 | 2025 | 2026 | ||||||
| TECHNICAL SPECIFICATIONS | DETAIL | STANDARD | ADVANCED | STANDARD | ADVANCED | STANDARD | ADVANCED | |
| Controled impedance | +/- 10% | Upon request | +/- 10% | Upon request | +/- 10% | Upon request | ||
| Minimum dielectric thickness | 100μm (0.004") | Upon request | 76μm (0.003") | Upon request | 76μm (0.003") | Upon request | ||
| External copper thickness | 1/3oz – 3oz (12μm – 105μm) | 4oz (140μm) | 1/3oz – 3oz (12μm – 105μm) | 5oz (175μm) | 1/3oz – 3oz (12μm – 105μm) | 6oz (210μm) | ||
| Internal copper thickness | 1/2oz – 1oz (17.5μm – 35μm) | >2oz (70μm) | 1/2oz – 3oz (17.5μm – 35μm) | >3oz (105μm) | 1/2oz – 3oz (17.5μm – 35μm) | >3oz (105μm) | ||
| Semiflex PCB | ||||||||
| 2024 | 2025 | 2026 | TECHNICAL SPECIFICATIONS | STANDARD | ADVANCED | STANDARD | ADVANCED | STANDARD | ADVANCED |
| Raw material | - | SB170G & SB170GB | SB170G & SB170GB | |||||
| TG | - | 170°C | 170°C | |||||
| Bending angle | - | Up to 180° | Up to 180° | |||||
| Number of layers in bending zone | - | Up to 2 | Up to 2 | |||||
| Bending zone thickness | - | 0.20mm [± 0.05mm] | 0.20mm [± 0.05mm] | |||||
| Solder mask | - | ELPEMER SD 2463 FLEX-HF - GREEN | ELPEMER SD 2463 FLEX-HF - GREEN | |||||